Non-contact inspection of semiconductor chips and lead frames

Inspection solutions for fast and accurate quality assurance of semiconductor chips and lead frames for electric vehicle power electronics

The rapid development of electronics over the last few decades has seen semiconductors and lead frames become essential components across virtually every industry – automotive in particular. The power electronics required in electric and hybrid vehicles are just one example of how pervasive electronic systems have become to manufactured products in other industries. 

With the volume of electronic components required, manufacturers are increasingly reliant on automated assembly for semiconductors and other similar parts. This brings unique quality assurance challenges as producers of semiconductor components and electronic assemblies in general must inspect extremely large numbers of these filigree structures for dimensional accuracy. But advanced miniaturisation means their microscopically small conductor paths and electronic contacts cannot be verified with conventional test equipment or microscopes. Yet for the economic inspection of larger samples and possibly even 100% inspection, it is essential that all relevant contours can be automatically and comprehensively recorded. 

Hexagon’s multisensor coordinate measuring machines (CMMs) provide both the non-contact sensor technology and large-batch processing options to meet the demands of electronic components inspection and quality assurance. Coupled with the dedicated vision metrology software, they ensure simple part programming yet comprehensive measurement results. 

Our Solutions

Explore Hexagon solutions for semiconductor chip and lead frame inspection

Multisensor CMMs

Combining tactile and non-contact sensors with unique design for part accessibility, the OPTIV M CMM range is ideal for electronics manufacturing.

Software with a vision

The dedicated vision measurement capabilities within PC-DMIS ensure complex electric component inspection routines are easy to program. 

Case studies

Learn more about measuring electronic components with Hexagon solutions 

Electronic component inspection

Learn more about the 2D video inspection of lead frames, an essential electronic component, in this application report. 

問い合わせ先

Hexagon Manufacturing Intelligence
ヘキサゴン・メトロジー株式会社(本社)
〒252-0132 神奈川県相模原市緑区橋本台 
1-15-8
Sagamihara-shi (Kanagawa-Ken)
Japan

T: +81 42 700 3500
F: +81 42 700 3511

販売・営業部門 カスタマーサービス部門

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